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Lecture Hall ICM - Internationales Congress Center München European Conferences on Biomedical Optics (ECBO) > Diffuse Optical Spectroscopy and Imaging > Advances in Instrumentation and Technology I
09:00-09:15 h | ICM - Internationales Congress Center München ICM Room 5
Subjects: Biophotonics and Medical Engineering
Chairman: Davide Contini (, Politecnico di Milano)
Diffuse Optical Tomography (DOT) has numerous advantages (it is non-invasive, non-ionizing, inexpensive and well tolerated by a wide range of subjects), but its uptake as a functional neuroimaging method has been limited by several fundamental challenges. These challenges include its traditionally limited resolution and the sensitivity of diffuse optical methods to haemodynamics in the superficial tissues (particularly the scalp), which can corrupt measurements of the brain. In recent years, a range of studies have demonstrated that increasing the sampling density of DOT methods significantly improves both their resolution and their ability to separate scalp and brain haemodynamics. However, the continued use of optical fibre bundles limits how far researchers have been able to push high-density DOT methodologies. The size and weight of optical fibre bundles restricts how many sensors can be applied to the scalp, which in turn limits sampling density and/or field-of-view. In late 2016, we presented the first functional images of the human brain obtained using a fibreless, high-density DOT system known as the micro-NTS (μNTS). Since that time, our commercial collaborators Gowerlabs Ltd. have taken significant steps in the development of this technology to produce the first commercial modular high-density DOT device. In this submission, we discuss the development of this technology and the results of a series of proof-of-concept functional neuroimaging studies using this new device. We also discuss the simultaneous development of an infant-specific HD-DOT system, which reduces the size and weight of the sensor modules yet further by exploiting advance flex-rigid PCB construction.